Printed Electronics Symposium

GAAmericas Printed Electronics, Functional Printing & Intelligent Packaging Symposium

Date: 2015 Event TBD.  See the details for the 2014 event below.


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GAAmericas Printed Electronics, Functional Printing & Intelligent Packaging Symposium

Forging Effective Design-to-Commercialization Value Chains

Date: June 23-24, 2014

Clemson University
James Martin Inn
230 Madren Center Drive
Clemson, SC  29634
The James Martin Inn is full.  Nearby hotels include the Holiday Inn Express (864-654-9410) and the Courtyard by Marriott (864-654-8833) which are within three miles of our facility.

Registration Options:

  1. Click here to register online.
  2. Click here to download a registration form and fax to 201.523.6048.
  3. Call Allen Krusenstjerna at 201.523.6042 x104 to register by phone.  Please note:  Employees of symposium association partners MUST call Allen to register in order to receive the appropriate rate.

Registration Rates:  Employees of GAAmericas member companies and employees of Symposium Association Partners pay an early bird rate of $595, regular rate of $695 and an on-site rate of $750.  All others pay $795 (early bird), $895 (regular) and $950 (on-site). Please note: The early bird cut off date is 5/23/2014.


The GAAmericas 4th Printed Electronics, Functional Printing & Intelligent Packaging Symposium is an interdisciplinary two-day event being held at the Clemson Sonoco Institute of Packaging and the Madren Center at Clemson University on June 23-24, 2014 that you need to attend if you are a packaging, product development, IT or brand specialist responsible for innovation, design, purchasing or marketing.

The theme for this year’s symposium is "Forging Effective Design-to-Commercialization Packaging and Product Value Chains for an Internet of Things"

Do you know how intelligent packaging, printed electronics, functional printing, collaborative innovation and the Internet of Things (IoT) could change your business over the next 3-5 years?

  • Freedonia Group predicts U.S. demand for active and intelligent packaging will grow 8% per year to $3.5 billion in 2017, well above total packaging demand growth.
  • McKinsey’s Disruptive Technologies Report says the Internet of Things is a disruptive technology trend that will connect billions of products, packages and sensors.
  • International Data Corporation estimates that revenues from technology and services related to the Internet of Things will grow 8.8% annually to $7.3 trillion by 2017.
  • The venture capital research firm CBInsights reports that IoT startups attracted $1.1 billion in investment across 153 deals last year,  up 11% from 2012.
  • Xerox estimates the global market for flexible, printed, and organic electronics for products, packaging and sensors is expected to reach $45 billion by 2016.
  • Cisco CEO John Chambers believes that the "Internet-of-Everything" will rapidly evolve into a $19 trillion market with 5X to 10X the impact on society as the Internet.

With growth and change like that on the horizon can you afford to not know?

Make no mistake, these technologies and projections are not science fiction… these are business imperatives that you need to address… and this symposium is the place for you to begin.

This event brings a diverse group of trail-blazers and thought leaders together from key organizations in a highly interactive setting to share their considerable experience and practical perspectives on how to profit from these technologies today.  Learn how to create value and competitive advantage.

Learn how to connect to the connected revolution that is under way.

Reserve your opportunity to network with a plugged-in group of innovators and learn from the perspectives shared by scheduled speakers at the symposium.  Speakers include Bruce Smith, Senior Director of Global Packaging Process Innovation for The Molson Coors Brewing Company, James Earle, Advanced Manufacturing Engineer for LocalMotors, Lisa M. Nieman, Director of Customer Segmentation with the U.S. Postal Service, Humair Mandavia, Executive Director of the Zuken SOZO Center, Faculty from Clemson's Sonoco Institute, and entrepreneurs from ground-breaking startups like Electrozyme, and Tactonic Technologies.

Topics to be addressed in this year's program include:

  • Innovation in Intelligent/Interactive Products & Packaging: Yesterday, Today and Tomorrow
  • Intelligent/Interactive Packaging: Brand Owner & Supply Chain Perspectives
  • Collaborative Innovation, Functional Printing, Printed Electronics, Microfactories and You
  • New Printed Electronics Sensors and Cyber Physical Systems
  • The Internet of Postal Things, RFID, NFC and the Quantified Consumer
  • Technology Roadmaps & Standards for Printed Electronics 
  • An Update on FlexTech Alliance Initiatives in Printed Electronics
  • Tools for Model-Based Design & Simulation of Printed Electronics 
  • Intellectual Property and Innovation: An Overview of Best Practices
  • Printed Electronics Materials, Processes & Business Resources 
  • Sonoco Institute Printed Electronics Pressroom Tour and Demonstrations 
  • Substrates, functional inks, coatings, adhesives and processes for printed electronics
  • Brand Protection, Brand Security, Product Safety & Functional Printing 

The first day of the program will provide an introduction to technologies, roadmaps, standards, and best practices, as was well as tour of a printed electronics pressroom, technology demonstrations and a networking event in the evening. The second day’s presentations and panels will explore a variety of high value markets and applications in depth and provide ample time for questions, discussion and networking. 

If you are interested in attending the syposium or have questions about it, please contact Phil Pimlott ( or Don Carli (

Many Thanks to Our Symposium Sponsors:

     Silver Level Sponsor
     innovation Sponsor
     Bronze Level Sponsor
     Bronze Level Sponsor


   Bronze Level Sponsor
     Bronze Level Sponsor
     Contributing Sponsor
     Supporting Sponsor


















Many Thanks to our Symposium Association Partners:


Many Thanks for our Symposium Media Partners: